Material Properties
High thermal conductivity: The thermal conductivity coefficient is usually between 20-30 W/(m·K) (such as alumina ceramics), and some materials (such as aluminum nitride and silicon nitride) can reach 70-200 W/(m·K).
High insulation: Withstand voltage up to 13 kV, suitable for high-voltage environments.
High temperature resistance: Can withstand temperatures up to 1600°C, suitable for high-power equipment.
Mechanical strength: Some products are enhanced through special processes, being shock-resistant and wear-resistant (such as not breaking when dropped from a height of three meters).
Application scenarios
Electronic heat dissipation: Thermal conduction and insulation for power devices such as ICs, MOSFETs, and IGBTs.
LED packaging: As a substrate to enhance heat dissipation efficiency.
New energy sector: Such as electric vehicle batteries and solar panels.
Aerospace: High-temperature resistant components.
Purchasing Suggestions
Heat Conduction Requirements: For high-power devices, aluminum nitride or silicon nitride can be selected.
Cost Consideration: Aluminum oxide offers good cost performance and is suitable for general applications.
Customization Service: Dongguan Nodi provides customization services.
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