ND3500 - T025 TDS Ultra - High Thermal Conductivity Silicone Film

Product Features:

• Excellent thermal conductivity, low thermal resistance, and stable performance, ensuring reliable use over an extended period;

• Bridging the manufacturing tolerances in the structure, reducing the requirements for the manufacturing tolerances of heat sinks and heat dissipation structural components;

• It has a certain degree of flexibility and excellent insulation properties;

• The surface is flat and smooth, and it has good adhesion performance on the surfaces of various metallic and ceramic devices; It offers the convenience of being reusable.  

  
  

Storage and Packaging Specifications:

• In order to ensure that the product maintains good quality, it should be stored in a dry environment at a room temperature of 25°C. During the storage period, the environment should be kept clean and free of dust to prevent external contamination from affecting the electrical characteristics.

• Packaging Specifications: Sheet packaging; 400mm * 200mm (with thicknesses of 0.25mm and 0.38mm), and it can be customized according to customers' requirements. 

Application methods:

• It can be used in the following ways: automatic pasting and manual pasting.

  
  

Application areas：

• Between the aluminum base plate and the heat sink;

• For heat conduction between MOS transistors, transformers (or capacitors/PFC inductors) and the heat sink or the casing;

• For heat conduction and dissipation between the motherboard ICs and the heat sink or the casing;

• Applications in the automotive electronics industry (such as xenon lamp ballasts, audio systems, in-vehicle series products, etc.);

• Between the power amplifier ICs, image decoder ICs and the heat sinks (casings);

• In microwave ovens/air conditioners (between the power ICs of the fan motors and the casings)/induction cookers (between the thermistors and the heat sinks). 

Technical parameters：