Category：Conductive mud
Performance and Characteristics：
High thermal conductivity and low thermal resistance.
It has the same plasticity as plasticine and is very suitable for filling products with large thickness variations.
Superior anti - aging performance.
Low stress, low modulus, and self - adhesive.
Superior high - temperature resistance, excellent weather and radiation resistance.
Superior chemical and mechanical stability.
Typical applications：
Widely used in
LEDs
Microprocessors
Memory modules
Cache memories
Sealed integrated chips
DC/DC converters
IGBTs and other power modules
Power semiconductors
Solid-state relays
Bridge rectifiers and other fields
Technical Parameters：
| ND-N103 Thermal Conductive Mud | ||||
| Items | Unit | Metric value | Testing method | |
Configuration parameter | Form | — | Putty | Visual |
| Color | — | Grey | Visual | |
| Density | g/cm3 | 2.5 | ASTM D792 | |
| Electric parameter | Breakdown Voltage | kV/mm ac | >6 | ASTM D149 |
| Dielectric constant | — | 5 | ASTM D150 | |
| Volume Resistivity | Ω·cm | 1012 | ASTM D257 | |
Parameter of Thermally Conductive property | Thermal Conductivity | W/m·K | 3.0 | ASTM D5470 |
| Thermal Impedance | ℃·in2/W | 0.37 | ASTM D5470 | |
| Reliability | Volatility rate | % | <1.0 | 200℃，240H |
| Working life | year | 15 | — | |
| Continuous using temp | ℃ | -60-200 | — | |
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